Abstract This paper presents a negative-tone photoimageable spin-on dielectric material that is based on a unique molecule for wafer level packaging application. The molecule is an extended polyimide having photoactive […]
During the transfer molding or injection molding process, the epoxy is exposed to elevated temperatures and pressure. At temperature and under pressure, the epoxy mold compound’s viscosity will drop significantly […]
It gives me great pleasure to welcome Anna Rutkowska, who, effective the 1st of February 2018, will take up the position of Business Process Analyst at CAPLINQ Europe BV and […]
By definition, once a resin and hardener are mixed, the system becomes a B-stage epoxy system. This definition however, is too vague for our purposes. What we need is a […]
Electromagnetic interference (EMI) shielding is used in electrical parts to reduce the electromagnetic induction in a field. Copper foil tape is usually used to block the field as it is […]
Materials such as paper, textile, and plastic contain an equal number of positive and negative charge, i.e., they are electrically balanced. Friction is known to disturb the balance causing the […]
In order to understand the shelf-life, expiration date, and product fitness for use it is important to understand the basics of epoxies and the mechanism through which they get hard […]
Mold conditioner is a chemical that is used to prevent other materials from bonding to the surfaces. They act as an obstruction between surfaces facilitating the separation of a cured […]
