Reducing import duties: How to determine value of goods
Foreign suppliers looking to import goods into the European Union (EU) are subject to import duty based on a number of factors. One of the factors that affects the duty […]
Applications for Solder spheres
A solder sphere is a ball of solder that ensures the bond between the chip package and the printed circuit board. CAPLINQ takes pride in offering one of the highest […]
Low Stress Dielectric Layers for Wafer Level Packages to Reduce Wafer Warpage and Improve Board-Level Temperature-Cycle Reliability
Abstract This paper presents a negative-tone photoimageable spin-on dielectric material that is based on a unique molecule for wafer level packaging application. The molecule is an extended polyimide having photoactive […]
Effects of time and temperature on molding compounds minimum achievable viscosity
During the transfer molding or injection molding process, the epoxy is exposed to elevated temperatures and pressure. At temperature and under pressure, the epoxy mold compound’s viscosity will drop significantly […]
Anna Rutkowska joins CAPLINQ Europe BV as Business Process Analyst
It gives me great pleasure to welcome Anna Rutkowska, who, effective the 1st of February 2018, will take up the position of Business Process Analyst at CAPLINQ Europe BV and […]
B-Stage Epoxy Molding Compound Cross-Linking
By definition, once a resin and hardener are mixed, the system becomes a B-stage epoxy system. This definition however, is too vague for our purposes. What we need is a […]
Copper Foil Tape for EMI Shielding
Electromagnetic interference (EMI) shielding is used in electrical parts to reduce the electromagnetic induction in a field. Copper foil tape is usually used to block the field as it is […]
Linqstat Electrically Conductive and Antistatic Plastic Film
Materials such as paper, textile, and plastic contain an equal number of positive and negative charge, i.e., they are electrically balanced. Friction is known to disturb the balance causing the […]