Deo Navaja: Technical Service Manager
Welcoming Caplinq’s Global Technical Service Manager Welcome aboard, Deorex David Navaja! We are happy to announce that Deo has joined Caplinq as our new Global Technical Service Manager for almost […]
Semiconductor
Introducing Joshua Bullago: Global Regulatory Compliance specialist
We are happy to introduce Joshua Bullago. one of our newest team members. As a Global Regulatory Compliance Specialist at CAPLINQ, he plays a crucial role in ensuring compliance with […]
Samsung SDI discontinue Epoxy Molding Compound for Power Discrete Semiconductors
In the second half of August of 2018, Samsung SDI announced that it was exiting the epoxy molding compound for power discrete semiconductor packages. With almost a 4% market share […]
Same Size Die Stacking | Wafer Back Side Coating (WBC) Options
Shin-Etsu SFX-513S, SFX-524A and SFX-526A are Wafer Backside Coating (WBC) Options for same-size die stacking.
Same-Size Die-Stacking Options | DDAF, WBC, Spacers
Same size die stacking is different from other die stacking in that the bondline thickness must be a minimum of 60µm – 80µm high to ensure enough wirebond-loop height. In […]
