This category supports CAPLINQ Die attach materials. These products focus primarily on die attach and semiconductor packaging materials. Therefore, the category delivers news and information designed to engage professionals that have questions or comments concerning the proper use and applications of these products.
If you’ve ever worked with high-performance adhesives, you know they’re a game-changer for electronics manufacturing. These products, such as LOCTITE ABLESTIK ABP 6392TEA and LOCTITE ABLESTIK ABP 6395T, are engineered […]
What is outgassing? Outgassing occurs when gas is released from a solid or liquid material due to increasing temperature, decreasing pressure, and certain chemical reactions like decomposition. Ultra-low pressure levels […]
Adhesives in film format are an increasing topic of interest. They have similar formulations to traditional die attach pastes and assembly pastes but they come in sheets with custom dimensions […]
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Curing die attach pastes in a vacuum is not a great idea after all. Evaporation, lack of heat uniformity and contamination are to blame.
Die attach films enable very thin dies, eliminate fillets and achieve uniform bondline thickness. This aids miniaturising and 2.5D and 3D die stacking.
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Identifying resin bleed, separation and outgassing causes and troubleshooting the process, equipment and materials to reduce or eliminate it.
When it comes to high thermal conductivity die-attach options, an engineer is presented with four basic options: Electrically Conductive Die Attach Pastes Semi-Sintering Die Attach Pastes Silver Sintering Pastes Solder […]
The fingerprint sensor market has been steadily expanding. The emergence of fingerprint unlock for smartphones and laptops, the high adoption rates among governments and the emergence of biometric smart cards […]
