Deo Navaja: Technical Service Manager
Welcoming Caplinq’s Global Technical Service Manager Welcome aboard, Deorex David Navaja! We are happy to announce that Deo has joined Caplinq as our new Global Technical Service Manager for almost […]
Welcoming Caplinq’s Global Technical Service Manager Welcome aboard, Deorex David Navaja! We are happy to announce that Deo has joined Caplinq as our new Global Technical Service Manager for almost […]
The adhesion strength between materials can directly impact the performance and durability of the interface. In the context of semiconductor packages that are composed of different layers with different material […]
Dr. H. W. Rauhut Research Scientist, Dexter Electronic Materials Division Technical Paper, April 1996 A SPECIAL POSITION Epoxy molding compounds hold a special position in electrical and electronic applications, primarily […]
Dr. H. W. Rauhut Research Scientist, Dexter Electronic Materials Division Technical Paper, March 1992 INTRODUCTION For about thirty years, electronic device encapsulation has been the charter of epoxy molding compounds. […]