This category supports CAPLINQ Encapsulants and Underfills. These products focus primarily on encapsulation, die attach and semiconductor packaging materials. Therefore, the category delivers news and information designed to engage professionals that have questions or comments concerning the proper use and applications of these products.
You uncap a syringe of epoxy expecting a smooth, free-flowing resin, only to find it’s thicker than usual, stringy, or already semi-solid. For production teams and process engineers, this raises […]
From 1965 to 2010, 2D packaging, also called planar integration, was the main way to assemble integrated circuits. In this method, chips sit side-by-side on a substrate or PCB. Manufacturers […]
Semiconductor packaging can be a daunting and complicated process. Encapsulants, Underfills, Die attach pastes, films and all the underlying technologies can be overwhelming due to the sheer amount of options. To reduce […]
Epoxy-based clear encapsulants are thermosetting polymers produced through the crosslinking of an epoxy resin and a suitable hardener. Within this thermosetting mixture, a number of additives are added, such as […]
The paper summarizes a recent research effort carried out at both Dexter Electronic Materials Division and The Dow Chemical Company. The interdependence of thermal conductivity with crucial properties of polymer-based […]
In recent years, the push towards safer and more sustainable materials has intensified. One critical area of focus is the use of Substances of Very High Concern (SVHC) in various […]
Repellency treatments are a category of surface treatments designed to protect various surfaces from both water and oil-based liquids. These coatings create a non-stick barrier on the surface that repels […]
Liquid encapsulants and Epoxy molding compounds are generally two sides of the same coin. But what sets them apart? Find out in this blog.
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