CAPLINQ to introduce Copper Foils for Battery, EMI, PCB
CAPLINQ will soon introduce a line of copper foil for shielding under its LINQSTAT brand name. The first product being developed is CFT3A: a 75um (3mil) Copper foil with a […]
CAPLINQ will soon introduce a line of copper foil for shielding under its LINQSTAT brand name. The first product being developed is CFT3A: a 75um (3mil) Copper foil with a […]
What is the heat capacity of epoxy mold compounds used in semiconductor assembly? Though this information varies based on many variables, the most critical parameters are the filler loading and […]
We recently received a query whether LINQSTAT electrically conductive plastic will conduct electricity through thickness? Will this electrically conductive plastic be suitable for the manufacture of a polymer based battery? […]
Mold conditioner is a “more-highly” wax-filled mold compound that conditions the mold for transfer molding epoxy mold compound. Prior to conditioning the mold, it is a common industry practice to […]
Customers often ask what is the maximum aspect ratio (Pellet Height or Length / Pellet Diameter) of epoxy molding compound (EMC). While this varies from manufacturer to manufacturer, the reason […]
Generally speaking, the acrylic adhesive will have higher adhesion at mid-range temperatures (0°C to 100°C), but silicone adhesives have higher adhesion at lower temperatures (under 0°C) and higher temperatures (above […]
This article summarizes the best cure schedules to use to optimize performance of the Shin-Etsu KJR-651E junction coating resin. The goal is to maximize adhesion and reduce gate current leakage at the maximum temperature when reverse voltage bias is applied.
Are you paying too much for 3M Velostat 1704 & 3M 1708? LINQSTAT™ VCF-Series is a black, carbon-filled, volume-conductive polyethylene film velostat alternative that meets military spec MIL-P-82646A commonly used as a static control material.