Process to remove cured KJR silicone from IC’s (Decapping)

Shin-Etsu KJR silicones are used extensively in the manufacture of ICs, transistors, diodes and other semiconductor devices.

KJR-4013E is a flexible, moisture-cure silicone most often used as junction-coating resins in the manufacture of diodes. KJR-651E, KJR-655E and KJR-657E are rigid thermoset polyimide-silicones used as junction coating resins in the manufacture of higher power diodes and thyristors. Both are used due to their excellent adhesion to epoxy molding compounds (EMC), high humidity resistance, and excellent volume resistivity and dielectric breakdown properties.

To be able to conduct failure analysis, customers have asked if there is a process to remove the cured silicone / polyimide-silicone from the diodes and/or thyristors (decap).

One recommendation is to use sulphuric acid (H2SO4) which can normally clearly strip organic compounds.  Nitric acid (HNO3) is another option.  If the dissolving rate is slow, adding heat to the process helps very much.  Of course, for either of these processes, a fume hood is necessary all the time.

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About Chris Perabo

Chris is an energetic and enthusiastic engineer and entrepreneur. He is always interested in taking highly technical subjects and distilling these to their essence so that even the layman can understand. He loves to get into the technical details of an issue and then understand how it can be useful for specific customers and applications. Chris is currently the Director of Business Development at CAPLINQ.

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