Heat Capacity of Epoxy Molding Compound

What is the heat capacity of epoxy mold compounds used in semiconductor assembly?

Though this information varies based on many variables, the most critical parameters are the filler loading and the loading percentage. Since most epoxy mold compounds use silica as filler and are on average between 80-85% loaded, the approximate heat capacity for these materials is 0.8J/gK.

For more information on epoxy mold compounds, or to request that CAPLINQ help you make the proper selection, please contact us or visit the CAPLINQ website today for more information.

About Chris Perabo

Chris is an energetic and enthusiastic engineer and entrepreneur. He is always interested in taking highly technical subjects and distilling these to their essence so that even the layman can understand. He loves to get into the technical details of an issue and then understand how it can be useful for specific customers and applications. Chris is currently the Director of Business Development at CAPLINQ.

8 thoughts on “Heat Capacity of Epoxy Molding Compound

  1. Hi! I am doing a study about epoxy molding compound. I would like to ask the process on how to mix the epoxy resin, catalyst, silica filler, hardener, and additives. Preferably the detailed procedure. Thank you.

  2. what is the exact application of epoxy mold compound,which type of industries use it,and what are the grades available in the market.can you give us some ref no in India.

  3. Epoxy Mold Compound is used to encapsulate & protect semiconductor devices and electronic modules. Historically, ceramic packages with soldered and glass-fired seams were used, but because of the high price of such packages, now these are typically only reserved for medical, military or aerospace applications – applications where the cost-to-change due to regulatory or customer specifications is very, very high compared to the cost of the materials themselves.

    More cost-sensitive devices, such as consumer handhelds, mobile phones, computers and any other electronic device now use epoxy to encapsulate and protect. Epoxy comes in several forms, the most familiar being liquid, 2-part form. These epoxies were also used extensively while the device mix was high and volumes were relatively low.

    Nowadays, some manufacturers and facilities make 20 – 40 billion parts per year, and a liquid encapsulation system would be an enormous bottle neck. Epoxy Molding Compounds are pre-mixed, b-staged epoxies that are put into molding machines and transfer-molded over semiconductors and oher devices. Even automotive manufacturers are implementing epoxy mold compounds to encapsulate engine control units (ECU) and other automotive components.

    Because the equipment required to mold devices is very expensive and has limited flexibility compared to liquid-dispense systems. The push to go from liquid epoxies to mold compounds is only justified once the mix is low enough and the volume is high enough to justify this investment. All major semiconductor companies use this technology today.

  4. hi!i’m currently working on my thesis on semicon.i was just wondering is it possible make a epoxy moulding compound from diglycidyl ether of bisphenol- A (DGEBA) with the addition of MMT clay? what are the things needed for it to qualify and be called a moulding compound. i would be really grateful for your reply. thank you!

  5. Kindly let me know how are major manufecturers of epoxy Moulding Compound in india? r u having any data about Epoxy compound Manufecturers to indian industry?

    i would be greatful for your reply.

  6. CAPLINQ represents SolEpoxy Epoxy Molding Compounds, a major Epoxy Molding Compound supplier of Coating Powders, and Industrial Molding Compounds for Automotive and Industrial Applications. Furthermore, we have an existing supply chain already to India. Please send us a the detailed specification you require and we can recommend a product for you and provide a sample.

  7. hello. I’m a university student in Korea. I would like to ask you about epoxy molding compound. I have to find a method to reduce CTE and increase thermal conductivity but I can’t find materials in google or other websites. I think that some ingredients are contorlled in EMC. Please help me I really need some advice.

Leave a Reply

Your email address will not be published. Required fields are marked *