Hongyu Yu joins CAPLINQ as Application & Product Engineer
I am happy to announce that effective June 29th, 2020, Hongyu Yu has joined CAPLINQ as Application and Product Engineer. Working full time out of our new offices in Assendelft, […]
I am happy to announce that effective June 29th, 2020, Hongyu Yu has joined CAPLINQ as Application and Product Engineer. Working full time out of our new offices in Assendelft, […]
Customers looking for high-reliability one- and two-component thermal interface gels that can be printed finally have a solution they can count on. Customers are often faced with the challenge of […]
When it comes to high thermal conductivity die-attach options, an engineer is presented with four basic options: Electrically Conductive Die Attach Pastes Semi-Sintering Die Attach Pastes Silver Sintering Pastes Solder […]
When selecting the right Phase Change Material Pad thickness for your application, thinner isn’t always better As any thermal design engineer knows, all other things being equal, Thermal Interface Materials […]
I am happy to announce that effective November 25th, 2019, Arthur da Rocha Geremia has joined CAPLINQ as Sales Engineer. Working full time out of our offices in Heemskerk, Netherlands, […]
The fingerprint sensor market has been steadily expanding. The emergence of fingerprint unlock for smartphones and laptops, the high adoption rates among governments and the emergence of biometric smart cards […]
Long considered an industry standard, MJ Gordon Permasil #909C carnauba wax spray is no longer available and is now replaced by Chemlinq MRE-C909. If any manufacturer of semiconductor devices were […]
CAPLINQ EUROPE BV SIGNS DEFINITIVE AGREEMENT TO REPRESENT HENKEL SEMICONDUCTOR PACKAGING MATERIALS IN EUROPE Amsterdam, The Netherlands (WEBWIRE) – October 10th, 2019 – CAPLINQ Europe BV announced today that it has become Henkel’s […]