The fingerprint sensor market has been steadily expanding. The emergence of fingerprint unlock for smartphones and laptops, the high adoption rates among governments and the emergence of biometric smart cards for banking, financial services and insurance (BFSI) applications are the key drivers of market growth.
Sales of fingerprint sensors are projected to generate $3.5 billion in 2019, and then rise dramatically at a 15.3 percent CAGR to $7.1 billion by 2024, according to a new report from Markets and Markets. Capacitive sensors are expected to remain the leading sensor type, while the largest size of this growth augmentation will unsurprisingly come from the Smartphone industry and end-use consumer electronics applications.
The region with the largest share of the global market will be Asia-Pacific, according to the “Fingerprint Sensor Market” report. That doesn’t mean that the European market is planning to lag behind. LOCTITE ABLESTIK ABP 6892 has been already qualified as a Fingerprint Card sensor inlay in biometric bank cards while leading manufacturing companies have already received orders for pre-production runs and customer trials. Everyone is preparing for market adoption and boom.
LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste was designed to be used for fingerprint sensors. With its low stress and robust mechanical properties, it is targeted for applications that require the bonding of fingerprint sensors in credit cards (such as VISA, Mastercard and American Express), bank cards or other cards that require a secondary authentication process. Sensors and devices using the ABP 6892 die bonding material will have a greater resistance to delamination and overall improvement in package reliability.
Please visit our website to learn more and view our entire range of Die attach materials including Die attach pastes and specifically LOCTITE ABLESTIK ABP 6892. You can also contact us if you have any questions about Semiconductor packaging, fingerprint sensors or relevant applications.
