Applications for Solder spheres
A solder sphere is a ball of solder that ensures the bond between the chip package and the printed circuit board. CAPLINQ takes pride in offering one of the highest […]
This category is designed to support CAPLINQ’s solder sphere and solder ball product offering and engage professionals that have have questions or comments concerning the proper use and applications of these products.
Guests are invited to discuss their applications, ask questions and offer comments and feedback.
A solder sphere is a ball of solder that ensures the bond between the chip package and the printed circuit board. CAPLINQ takes pride in offering one of the highest […]
Today, the electronics industry has made tremendous advancements in every aspect. It’s easy to spot new and innovative technology enhancing the cost effectiveness and reducing the production time at every […]
Applications that requires precise amount of solder usually use packaging of solder spheres on tape and reel. As examples, Flip chip, also known as controlled collapse chip connection (is a […]
Recently, we have been asked more and more often to produce low-temperature eutectic bismuth-tin solder spheres for our customers. Previously, bismuth-tin was used by only a few customers for niche […]
Assuming what you are looking are low cost solder spheres, and not cheap solder balls, you have come to the right place. If you want to buy cheap solder balls, […]
In our article “How is a high quality solder sphere made?”, we discuss that high quality solder spheres are more resistant to oxidation. This article describes solder ball oxidation, how […]
In the article “How is a high quality solder sphere made?”, we highlighted that one of the characteristics of high quality solder spheres are that they have uniform diameters and […]
Due to the tiny size of solder balls and the fact that there can be hundreds or even thousands of solder balls used on a single device, customers not only […]