Curing die attach in a Vacuum
Curing die attach pastes in a vacuum is not a great idea after all. Evaporation, lack of heat uniformity and contamination are to blame.
Garrett Schrum celebrates 9 months at CAPLINQ as Sales Engineer
I am happy to announce that as of September 4th, 2021, Garrett Schrum celebrated his 9 months anniversary with CAPLINQ Americas as Sales Engineer. Working out of our offices in […]
Die stacking and miniaturising with Die attach films
Die attach films enable very thin dies, eliminate fillets and achieve uniform bondline thickness. This aids miniaturising and 2.5D and 3D die stacking.
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Why do we need Reworkable Underfills?
If you have been paying attention to the product developments over the last few years, reworkable underfills are gaining more and more traction over non reworkable ones. Without thinking about […]
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EMI Shielding and SinterInks for 5G RF components
Package level EMI shielding reduces the dimensions and weight of the overall design and provides a compact and effective shielding method.
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Phase change materials: 101 – A quick overview
What are Phase change materials? Phase change materials (PCM) are silicone free pads and stencil printable pastes that are typically used as matrix materials for thermal interface applications. The magic […]
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Troubleshooting Resin bleed in Die attach
Identifying resin bleed, separation and outgassing causes and troubleshooting the process, equipment and materials to reduce or eliminate it.
Donovan Cerneüs joins CAPLINQ as Technical Sales Representative
I am happy to announce that effective November 9th, 2020, Donovan Cerneüs has joined CAPLINQ as Technical Service Representative. Donovan will be working full-time out of our new offices in […]