Machine (MD) and Transverse (TD) directions
Machine and Transverse directions are two crucial tape properties that define the orientation of their measured specifications.
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Elisabetta Cesaroni joins CAPLINQ as Customer Service Representative
I am happy to announce that as of September 6th, 2021, Elisabetta Cesaroni has joined CAPLINQ as Customer Service & Order Process Administrator. Working out of our offices in Assendelft, […]
Natalja Vasseur joins CAPLINQ as QHSE Administrator
I am happy to announce that as of August 16th, 2021, Natalja Vasseur has joined CAPLINQ as Quality, Health, Safety & Environment (QHSE) Administrator. Working out of our offices in […]
Curing die attach in a Vacuum
Curing die attach pastes in a vacuum is not a great idea after all. Evaporation, lack of heat uniformity and contamination are to blame.
Garrett Schrum celebrates 9 months at CAPLINQ as Sales Engineer
I am happy to announce that as of September 4th, 2021, Garrett Schrum celebrated his 9 months anniversary with CAPLINQ Americas as Sales Engineer. Working out of our offices in […]
Die stacking and miniaturising with Die attach films
Die attach films enable very thin dies, eliminate fillets and achieve uniform bondline thickness. This aids miniaturising and 2.5D and 3D die stacking.
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Why do we need Reworkable Underfills?
If you have been paying attention to the product developments over the last few years, reworkable underfills are gaining more and more traction over non reworkable ones. Without thinking about […]
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EMI Shielding and SinterInks for 5G RF components
Package level EMI shielding reduces the dimensions and weight of the overall design and provides a compact and effective shielding method.
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