Daniel Wong joins CAPLINQ as a Regional Sales Manager for Malaysia
We are happy to announce that effective August 1st, 2022, Daniel Wong has joined CAPLINQ as a Regional Sales Manager in Malaysia. Daniel will be working full-time out of Greater […]
Luis Antonio Gutiérrez joins CAPLINQ as a Field Application Engineer
We are happy to announce that effective July 1st, 2022, Luis Gutiérrez has joined CAPLINQ as a Field Applications Engineer. Luis will be working full-time out of Mexico City, supporting […]
Incoterms 2020
Incoterms is an abbreviation of the expression “International Commercial Terms” and represents specific commercial terms originally published by the International Chamber of Commerce (ICC). These terms are primarily intended to […]
Carbon papers for Fuel Cells & Electrolyzers
Carbon plates for fuel cells and electrolyzers
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Dual cure adhesives for Precision alignment
Dual cure UV adhesives are materials that require two curing methods to fully cure. Either UV and Heat, Moisture and heat or other combinations, these adhesives are designed for specific, […]
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Optical reliability of film adhesives
Adhesives in film format are an increasing topic of interest. They have similar formulations to traditional die attach pastes and assembly pastes but they come in sheets with custom dimensions […]
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Evaluating and developing Mold release sprays
Mold release sprays are semiconductor mold maintenance products that are used in between transfer or compression molding shots to make sure that molded devices will “pop-off”” easily after cure. They […]
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Liquid Encapsulants VS Molding Compounds
Liquid encapsulants and Epoxy molding compounds are generally two sides of the same coin. But what sets them apart? Find out in this blog.
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