CAPLINQ Polyimide Tape used to sputter metals on wafers

CAPLINQ LINQTAPE Polyimide Film can be used to sputter metals, including precious metals like Gold (Au) and Titanium (Ti). This may be done for various reasons including:

  • Sputtering metals on silicon wafers
  • Study the inter-metallic layers formed during metal deposition
  • Study the metal-polyimide interface
  • Carry out X-ray photoelectron spectroscopy

The first test is to determine the thermal robustness of the CAPLINQ LINQTAPE PIT1SD and PIT2SD (double-sided, polyimide tape with silicone adhesive; 1mil and 2mil thick backing respectively). For the purpose of wafer metal deposition, Dr. Markus Lützelschwab, an R&D Engineer in the Optics & Packaging department of CSEM (Centre Suisse d’Electronic et de Microtechnique SA) carried out this test in Switzerland. He did some preliminary tests by sticking the PIT1SD and PIT2SD onto a glass container and heating the assembly using a hot-air solder tool. Using this test, he demonstrated that it showed the same thermal robustness as [single-sided] Kapton tape.

After this step, Dr. Lützelschwab sent the wafer with the LINQTAPE polyimide tape for a sputtering process. The LINQTAPE withstood easily the externally conducted sputtering process of Titanium and Gold. Attached is the picture of one corner of the LINQTAPE polyimde tape after sputtering.

For more information about polyimide tapes or any other of our products, visit us or contact us for more details.

About Chris Perabo

Chris is an energetic and enthusiastic engineer and entrepreneur. He is always interested in taking highly technical subjects and distilling these to their essence so that even the layman can understand. He loves to get into the technical details of an issue and then understand how it can be useful for specific customers and applications. Chris is currently the Director of Business Development at CAPLINQ.

Leave a Reply

Your email address will not be published. Required fields are marked *