B-Stage Epoxy Molding Compound Cross-Linking
By definition, once a resin and hardener are mixed, the system becomes a B-stage epoxy system. This definition however, is too vague for our purposes. What we need is a […]
b-stage
Same-Size Die-Stacking Options | DDAF, WBC, Spacers
Same size die stacking is different from other die stacking in that the bondline thickness must be a minimum of 60µm – 80µm high to ensure enough wirebond-loop height. In […]
