Same Size Die Stacking | Wafer Back Side Coating (WBC) Options
Shin-Etsu SFX-513S, SFX-524A and SFX-526A are Wafer Backside Coating (WBC) Options for same-size die stacking.
This category supports CAPLINQ silicone products. Silicones are a very broad category, but CAPLINQ focuses on the smaller niche applications that require specialty silicones. Therefore, the category delivers news and information designed to engage professionals that have questions or comments concerning the proper use and applications of specialty silicones in their industry.
As a result, guests are invited to discuss their applications, ask questions and offer comments and feedback as they relate to specialty silicones.
Shin-Etsu SFX-513S, SFX-524A and SFX-526A are Wafer Backside Coating (WBC) Options for same-size die stacking.
Same size die stacking is different from other die stacking in that the bondline thickness must be a minimum of 60µm – 80µm high to ensure enough wirebond-loop height. In […]
Shin-Etsu KJR silicones are used extensively in the manufacture of ICs, transistors, diodes and other semiconductor devices. KJR-4013E is a flexible, moisture-cure silicone most often used as junction-coating resins in […]
Generally speaking, the acrylic adhesive will have higher adhesion at mid-range temperatures (0°C to 100°C), but silicone adhesives have higher adhesion at lower temperatures (under 0°C) and higher temperatures (above […]
This article summarizes the best cure schedules to use to optimize performance of the Shin-Etsu KJR-651E junction coating resin. The goal is to maximize adhesion and reduce gate current leakage at the maximum temperature when reverse voltage bias is applied.
Shin-Etsu offer a range of silicone materials suitable for optical fiber coating. The fiber coating application can be broken down into two categories, the “primary coating” through which the light […]