B-Stage Epoxy Molding Compound Cross-Linking
By definition, once a resin and hardener are mixed, the system becomes a B-stage epoxy system. This definition however, is too vague for our purposes. What we need is a […]
Industrial Epoxy Mold Compound
This category supports CAPLINQ Epoxy Molding Compounds. Unlike other compounds, epoxies are considered functional because they insulate and protect both mechanically and environmentally. CAPLINQ’s supplies a range of mold compounds for both semiconductor applications as well as industrial applications. Therefore, the category delivers news and information designed to engage professionals that have questions or comments concerning the proper use and applications of epoxy molding compounds in their industry.
Products in this category include:
- Mold Compounds for Solenoids and Coil Bobbins
- Injection Grade Epoxy Molding Compounds
- Epoxy Mold Compound Cleaners
Furthermore, examples of typical topics discussed in this category include:
- Development of Class H or Class N Epoxy Molding Compounds
- Industrial applications that use epoxy molding compounds
- Thermally conductive epoxies for heat dissipation applications
As a result, guests are invited to discuss their applications, ask questions and offer comments and feedback as they relate to epoxy molding compounds.
How Epoxy Molding Compounds (EMC) cross-link, harden and cure
In order to understand the shelf-life, expiration date, and product fitness for use it is important to understand the basics of epoxies and the mechanism through which they get hard […]
Henkel Huawei sells Epoxy Mold Compound factory and Hysol brand to Chinese conglomerate
UPDATE: CAPLINQ has become the official exclusive representative of Hysol Epoxy Mold Compounds in Europe and the Americas Henkel has officially exited the epoxy mold compound (EMC) business with sale […]
CAPLINQ announces a new category of products: Optoelectronic Compounds
Caplinq is pleased to announce a new category of products to its product offering: Opteolectronic Compounds. This category of products is split over three distinct product groups: Optically Clear Mold […]
UL-approved Class B Epoxy Mold Compounds for Coil and Bobbin Encapsulation
UL gives all Epoxy Molding Powder Compounds a generic 130°C (Class B) operating temperature rating without testing Recently, we were asked if we could supply a UL-approved class B Epoxy […]
Risk to Shelf-Life of Epoxy during Shipping
The single biggest risk associated with storage at higher than the recommended storage conditions is a reduction of flow rate. Epoxy molding compounds when blended already have the resin/hardener combination […]
Environmental Philosophy + Sustainability = Green Chemistry!
At CAPLNQ, we care about the environment and the role that we can play in preserving it for our children and generations to come. This means that we think about […]
Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds
FILLERS ARE THE INGREDIENT THAT MOST AFFECT THE COEFFICIENT OF THERMAL EXPANSION AND THE THERMAL CONDUCTIVITY OF EPOXY MOLDING COMPOUNDS All molding engineers know that the Thermal Conductivity (TC) and […]
