Same Size Die Stacking | Wafer Back Side Coating (WBC) Options
Shin-Etsu SFX-513S, SFX-524A and SFX-526A are Wafer Backside Coating (WBC) Options for same-size die stacking.
WBC
Same-Size Die-Stacking Options | DDAF, WBC, Spacers
Same size die stacking is different from other die stacking in that the bondline thickness must be a minimum of 60µm – 80µm high to ensure enough wirebond-loop height. In […]
