Liquid Encapsulants VS Molding Compounds
Liquid encapsulants and Epoxy molding compounds are generally two sides of the same coin. But what sets them apart? Find out in this blog.
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Molding Compounds
How to Clean Epoxy Molding Compound with Melamine and Rubber Cleaning Sheets
LET CAPLINQ HELP YOU SELECT AND APPLY THE PROPER CLEANING AND CONDITIONERS FOR EPOXY MOLD COMPOUNDS FROM OUR RANGE OF MELAMINE AND RUBBER CLEANING PRODUCTS When using Epoxy Mold Compound […]
CAPLINQ signs distribution agreement with Hysol in Europe and the Americas
CAPLINQ EUROPE BV SIGNS DEFINITIVE AGREEMENT TO REPRESENT HYSOL EPOXY MOLDING COMPOUNDS IN EUROPE AND THE AMERICAS Amsterdam, The Netherlands (WEBWIRE) – October 5th, 2020 – CAPLINQ Europe BV announced today that […]
Effects of Epoxy Mold Compound Viscosity, Flow and Filler on Wire Sweep
Recently, a customer complained that he had a hard time correlating the wire bond sweep with material properties like spiral flow, filler content, filler size, etc. He was using mold […]
Glass Transition Temperature (Tg) of Epoxy Molding Compounds
By definition, the glass transition temperature (Tg) of an epoxy molding compound (EMC) is the temperature at which the EMC changes from a hard, glassy substance to a soft rubbery […]
Samsung SDI discontinue Epoxy Molding Compound for Power Discrete Semiconductors
In the second half of August of 2018, Samsung SDI announced that it was exiting the epoxy molding compound for power discrete semiconductor packages. With almost a 4% market share […]
Epoxy Molding Compounds – Pellet Sizes: Diameter, Height & Weight
In a previous article, we talked about how epoxy molding compound pellets have specific aspect ratios. In this article, we will explain in more detail how epoxy molding compounds pellets […]
Redefining Epoxy Mold Compound Shelf-Life
How time and temperature affect spiral flow and viscosity, but not shelf-life When it comes to epoxies and specifically epoxy molding compounds (EMC), end users often mistakenly define the terms […]
