LET CAPLINQ HELP YOU SELECT AND APPLY THE PROPER CLEANING AND CONDITIONERS FOR EPOXY MOLD COMPOUNDS FROM OUR RANGE OF MELAMINE AND RUBBER CLEANING PRODUCTS When using Epoxy Mold Compound […]
CAPLINQ EUROPE BV SIGNS DEFINITIVE AGREEMENT TO REPRESENT HYSOL EPOXY MOLDING COMPOUNDS IN EUROPE AND THE AMERICAS Amsterdam, The Netherlands (WEBWIRE) – October 5th, 2020 – CAPLINQ Europe BV announced today that […]
Recently, a customer complained that he had a hard time correlating the wire bond sweep with material properties like spiral flow, filler content, filler size, etc. He was using mold […]
By definition, the glass transition temperature (Tg) of an epoxy molding compound (EMC) is the temperature at which the EMC changes from a hard, glassy substance to a soft rubbery […]
In the second half of August of 2018, Samsung SDI announced that it was exiting the epoxy molding compound for power discrete semiconductor packages. With almost a 4% market share […]
In a previous article, we talked about how epoxy molding compound pellets have specific aspect ratios. In this article, we will explain in more detail how epoxy molding compounds pellets […]
How time and temperature affect spiral flow and viscosity, but not shelf-life When it comes to epoxies and specifically epoxy molding compounds (EMC), end users often mistakenly define the terms […]
During the transfer molding or injection molding process, the epoxy is exposed to elevated temperatures and pressure. At temperature and under pressure, the epoxy mold compound’s viscosity will drop significantly […]
