Curing die attach in a Vacuum
Curing die attach pastes in a vacuum is not a great idea after all. Evaporation, lack of heat uniformity and contamination are to blame.
Author: George Kountardas
Die stacking and miniaturising with Die attach films
Die attach films enable very thin dies, eliminate fillets and achieve uniform bondline thickness. This aids miniaturising and 2.5D and 3D die stacking.
View post to subscribe to site newsletter.
Why do we need Reworkable Underfills?
If you have been paying attention to the product developments over the last few years, reworkable underfills are gaining more and more traction over non reworkable ones. Without thinking about […]
View post to subscribe to site newsletter.
EMI Shielding and SinterInks for 5G RF components
Package level EMI shielding reduces the dimensions and weight of the overall design and provides a compact and effective shielding method.
View post to subscribe to site newsletter.
Phase change materials: 101 – A quick overview
What are Phase change materials? Phase change materials (PCM) are silicone free pads and stencil printable pastes that are typically used as matrix materials for thermal interface applications. The magic […]
View post to subscribe to site newsletter.
Troubleshooting Resin bleed in Die attach
Identifying resin bleed, separation and outgassing causes and troubleshooting the process, equipment and materials to reduce or eliminate it.
Epoxy Powder Pinholes – Repairing them in Capacitors, Resistors & Thermistors
Troubleshooting epoxy coating powder pinholes, their probable causes and the corrective actions we should take to eliminate them.
Fingerprint sensors market to double by 2024
The fingerprint sensor market has been steadily expanding. The emergence of fingerprint unlock for smartphones and laptops, the high adoption rates among governments and the emergence of biometric smart cards […]
