Environmental Philosophy + Sustainability = Green Chemistry!
At CAPLNQ, we care about the environment and the role that we can play in preserving it for our children and generations to come. This means that we think about […]
Author: Chris Perabo
Formulating Coating Powders for the Passive Electronic Component Industry
Pulled from the Dexter Electronic Materials archives, this technical paper was written in April 1996 by Jim Glover, Project Leader Abstract Many capacitors and resistors require an insulating coating after […]
Application of Powder Coatings for Electronic Component Protection
Pulled from the Dexter Electronic Materials (now SolEpoxy) archives, this technical paper was written in April 1995 by Joseph Kubic, Senior Laboratory Technician Understanding the correlation between components, coating powder […]
Pelnox falls short on delivery of Pelnox PCE-282 to Europe
No purchasing manager wants to imagine a scenario wherein their production lines are down due to a shortage of raw material. Recently, CAPLINQ is getting many requests from new customers […]
Varistor and Capacitor Processing Parameters with Epoxy Coating Powder
As users of Epoxy Coating Powders may understand, there are really two processes involved when applying the Epoxy Coating Powders to passive components such as varistors and capacitors: the application […]
P-N junction coating resins for diode assembly
Updated November 2016: CAPLINQ has developed its own brand of Junction Coating Resin Silicones for thyristors and other applications that require P-N junction coating resins. LCS-100 is our alternative to […]
Using BGA solder balls in solder sphere placement machines
Recently, a customer using BGA solder spheres in a semi-automatic BGA solder balls placement machine asked if it was ok to leave these solder spheres for several days in the […]
Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds
FILLERS ARE THE INGREDIENT THAT MOST AFFECT THE COEFFICIENT OF THERMAL EXPANSION AND THE THERMAL CONDUCTIVITY OF EPOXY MOLDING COMPOUNDS All molding engineers know that the Thermal Conductivity (TC) and […]
